Foreign particle or defect checking system for inspection of substrate or wafer, has size information processing device which processes size of foreign particle or defect on predetermined object

摘要

A signal processing circuit (105) performs the processing of the predetermined size of the foreign particle or defect information the registered signal in an defect detector. An output device performs the output of the size information of the foreign particle or defect from the defect detector and the output signal of the signal processing circuit. An illumination device (101) radiates light to a predetermined object to be checked. A light inspection device (104) determines the reflected light from the illuminated object, or the radiated light scattered by the illumination device. An defect detector registers a foreign particle or an defect on the object by synchronous processing of the detection signal. An independent claim is also included for a foreign particle or defect registering method.