Semiconductor device e.g. for motor vehicle air-conditioning unit, has insulating base mounted on the drain (main current) electrode and a connection zone covering the wiring joining the main current electrode

摘要

The semiconductor appliance has design modifications in order to prevent breakage in the connection between the drain-terminal and the conducting plate as a result of expansion and thermal movement of the semiconductor device. A number of semiconductor chips (24) are mounted on one or more arrangements on the substrate (22,23) and a main current electrode (drain) (26) is joined in common with each of the number of semiconductor chips (24) via the substrate.