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low dielectric constant composite film for integrated circuits of inorganic aerogel and an organic filler gepfropftes inorganic material as well as forg
low dielectric constant composite film for integrated circuits of inorganic aerogel and an organic filler gepfropftes inorganic material as well as forg
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机译:用于无机气凝胶和有机填料gepfropftes无机材料的集成电路的低介电常数复合膜,以及
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摘要
An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is composed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aerogel to fill at least partially the porosities of the inorganic aerogel. The composite dielectric material is thermally stable and has a satisfactory thermal budget. The method of forming an aerogel film includes the spinning of a precursor compound solution onto the wafer followed by supercritical solvent extraction carried out in the spinning chamber.
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