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Composite film with low dielectric constant for integrated circuits made of inorganic airgel and inorganic material grafted with an organic filler and its production
Composite film with low dielectric constant for integrated circuits made of inorganic airgel and inorganic material grafted with an organic filler and its production
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机译:由无机气凝胶和接有有机填料的无机材料制成的集成电路用低介电常数复合膜及其制造
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摘要
An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is composed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aerogel to fill at least partially the porosities of the inorganic aerogel. The composite dielectric material is thermally stable and has a satisfactory thermal budget. The method of forming an aerogel film includes the spinning of a precursor compound solution onto the wafer followed by supercritical solvent extraction carried out in the spinning chamber.
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