首页> 外国专利> Conditioning of the atmosphere in a process chamber for the treatment of substrates using control of pump speed and gas analysis to match requirements at each process stage

Conditioning of the atmosphere in a process chamber for the treatment of substrates using control of pump speed and gas analysis to match requirements at each process stage

机译:使用泵速和气体分析控制来满足每个处理阶段的要求,从而在处理室中调节气氛以处理基板

摘要

Pumping rate of gas from a substrate treatment process chamber is adjusted to maintain a pressure matched to each treatment stage in the processing chamber. Gas drawn upstream of a primary pump is analyzed, and the result is used to adjust the pumping rate as a function of pumped gas. Conditioning the atmosphere in a process chamber (1) for treatment of a substrate comprises: pumping the gas from the process chamber using a primary pump (3) connected to at least one upstream secondary pump; adjusting pumping speed to maintain pressure matched to each treatment stage in the process chamber; analyzing gas aspired upstream of the primary pump; and using the result of this analysis to adjust pumping speed as a function of the gas pumped, to determine evolution of the pressure in the process chamber during treatment phases. An Independent claim is included for a device for conditioning the atmosphere in a process chamber.
机译:调节来自基板处理处理室的气体的泵送速率,以维持与处理室中的每个处理阶段相匹配的压力。分析从主泵上游抽出的气体,并将结果用于根据抽气调节抽气速率。在处理室(1)中调节气氛以处理衬底包括:使用连接到至少一个上游辅助泵的主泵(3)从处理室中抽出气体;调节抽速以保持压力与处理室中的每个处理阶段相匹配;分析主泵上游吸入的气体;并使用该分析结果根据所泵送的气体来调节泵送速度,以确定处理阶段中处理室中压力的变化。独立权利要求包括用于调节处理室中的气氛的装置。

著录项

  • 公开/公告号FR2808098A1

    专利类型

  • 公开/公告日2001-10-26

    原文格式PDF

  • 申请/专利权人 ALCATEL;

    申请/专利号FR20000005094

  • 申请日2000-04-20

  • 分类号G05D27/00;B01J15/00;H01L21/306;

  • 国家 FR

  • 入库时间 2022-08-22 01:07:38

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