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Large scale integrated package for computer, forms wiring pattern on build up layer so that it is connected between substrate input/output terminal and bare chip input/output terminal
Large scale integrated package for computer, forms wiring pattern on build up layer so that it is connected between substrate input/output terminal and bare chip input/output terminal
A wiring pattern is formed on a build up layer (2) of substrate (1), so that it is connected between substrate input-output terminal and a bare chip input/output terminal (3). An Independent claim is also included internal connection method for large scale integrated (LSI) package.
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