首页>
外国专利>
Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
展开▼
机译:用于在多芯片模块中的各个集成电路芯片之间提供互连的电路和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A multi-chip module (“MCM”) and methods of operation and manufacture thereof. The MCM includes: (1) a substrate for supporting a plurality of separate integrated circuit (IC) chips thereon, (2) first and second separate IC chips mounted on the substrate, the first separate IC chip including first and second circuit portions coupled together by at least one signal conductor, and (3) interconnecting means that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion of the first separate IC chip.
展开▼