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Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member

机译:电极组件,阴极装置和电镀装置,包括覆盖阴极构件的内周缘的绝缘构件

摘要

An electrode assembly, including a cathode member is provided with a hole enclosed by a frame portion and a contact surface that comes into contact with an object to be plated at one surface of the frame portion. The cathode member include a conductive material such as copper plate. The cathode member is provided with a lead conductor. An insulating member is provided with holes and enclosed by frame portions, with the frame portions and placed on another surface of the frame portion of the cathode member. The frame portion of the first insulating member covers the internal circumferential edge of the cathode member over a width W1.
机译:包括阴极构件的电极组件在框架部分的一个表面上设置有被框架部分包围的孔和与待镀覆的物体接触的接触表面。阴极构件包括诸如铜板的导电材料。阴极构件设置有引线导体。绝缘构件设置有孔,并被框架部分包围,框架部分放置在阴极构件的框架部分的另一个表面上。第一绝缘构件的框架部分在宽度W1上覆盖阴极构件的内周边缘。

著录项

  • 公开/公告号US6181057B1

    专利类型

  • 公开/公告日2001-01-30

    原文格式PDF

  • 申请/专利权人 TDK CORPORATION;

    申请/专利号US19980152789

  • 发明设计人 INOUE SATOSHI;TANAKA TOYOAKI;

    申请日1998-09-14

  • 分类号H01J1/20;

  • 国家 US

  • 入库时间 2022-08-22 01:05:29

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