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Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners

机译:机械组件,用于调节电子设备的温度,该组件装配有热交换器,该热交换器与设备上除角部之外的整个平面接触

摘要

A mechanical assembly for regulating the temperature of a chip is comprised of a heat exchanger which has a face for mating with a planar surface on the chip. A frame is coupled to the heat exchanger such that the face of the heat exchanger is exposed and can contact the planar surface of the chip. And, the face of the heat exchanger has a shape which makes contact with the entire planar surface on the chip except for each of its corners. One particular embodiment of the heat exchanger has four grooves which extend from the face and which respectively align with the corners of the chip. Due to those grooves, initial contact between the face on the heat exchanger and the planar surface on the chip occurs on an edge of the chip which is spaced-apart from a corner. Consequently, the chance of breaking the tip of a corner off of the chip is reduced.
机译:用于调节芯片温度的机械组件包括热交换器,该热交换器具有用于与芯片上的平坦表面配合的面。框架连接到热交换器,使得热交换器的表面暴露并且可以接触芯片的平面。并且,热交换器的表面具有与芯片上除其每个角以外的整个平面接触的形状。热交换器的一个特定实施例具有四个槽,该四个槽从表面延伸并且分别与芯片的角对齐。由于这些凹槽,热交换器的表面与芯片上的平坦表面之间的初始接触发生在芯片的与拐角隔开的边缘上。因此,减少了从芯片上折掉拐角尖端的机会。

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