Non-contact method for assessing the quality of assembly of electronic devices based on registration and analysis of contact radio interference

摘要

The paper presents the results of research that can be put into the development and research of non-contact rapid method for assessing the quality of the assembly and installation of EM designs. To achieve the objectives, studied the behavior of the mechanical connection of the contact pairs, namely the definition of the contribution of R, L, C parameters contact joints in the modulation level and the spectral composition of the electromagnetic radiation mechanical contact pair. The method is based on the registration and analysis of artificially excited by contact noise when exposed to mechanical vibrations and harmonic electric high frequency signal on structural elements EM. Considered in the field of electromagnetic compatibility (EMC) as an undesirable phenomenon, the formation of contact interference can be used to evaluate the mechanical properties of a wide variety of designs and hardware devices, including the quality of assembly and installation (especially related to the effort of tightening fasteners).