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Method of fabricating photonic semiconductor device using selective MOVPE

机译:使用选择性MOVPE制造光子半导体器件的方法

摘要

A method of fabricating a photonic semiconductor device is provided, which is capable of preventing the performance of a fabricated photonic semiconductor device from degrading and its fabrication yield from lowering. In the step (a), a semiconductor substrate having a flat surface is prepared. In the step (b), a dielectric mask layer having an elongated opening is formed on the surface of the substrate. An elongated region of the surface of the substrate is exposed from the mask layer through the elongated opening. In the step (c), a diffraction grating is formed on a part of the elongated region of the surface of the substrate through the opening of the mask layer. In the step (d), semiconductor layers are successively and selectively formed on the elongated region of the surface of the substrate by a selective MOVPE process through the opening of the mask layer, thereby forming a multi-layer, elongated optical waveguide on the surface of the substrate. At least part of the waveguide is located on the part of the elongated region of the surface of the substrate and is contacted with the diffraction grating. In the step (e), the mask layer is removed from the surface of the substrate after the step (d).
机译:提供一种制造光子半导体器件的方法,该方法能够防止所制造的光子半导体器件的性能劣化并且其制造成品率降低。在步骤(a)中,制备具有平坦表面的半导体衬底。在步骤(b)中,在衬底的表面上形成具有细长开口的电介质掩模层。基板表面的细长区域通过细长开口从掩模层暴露。在步骤(c)中,通过掩模层的开口在衬底表面的细长区域的一部分上形成衍射光栅。在步骤(d)中,通过选择性的MOVPE工艺,通过掩模层的开口,在衬底的表面的细长区域上依次选择性地形成半导体层,从而在表面上形成多层的细长的光波导。基板的波导的至少一部分位于衬底表面的细长区域的一部分上,并与衍射光栅接触。在步骤(e)中,在步骤(d)之后,从基板表面去除掩模层。

著录项

  • 公开/公告号US6204078B1

    专利类型

  • 公开/公告日2001-03-20

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号US19990337537

  • 发明设计人 YASUMASA INOMOTO;

    申请日1999-06-22

  • 分类号H01L210/00;

  • 国家 US

  • 入库时间 2022-08-22 01:04:51

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