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Flip-chip mount board and flip-chip mount structure with improved mounting reliability
Flip-chip mount board and flip-chip mount structure with improved mounting reliability
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机译:倒装芯片安装板和倒装芯片安装结构,提高了安装可靠性
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摘要
A flip-chip mount board includes a circuit board provided with a plurality of conductor patterns to which a plurality of bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern and a connection pad, the wiring pattern serves as an interconnection, the connection pad is provided at a position corresponding to one of the bumps, the at least one wiring pattern and the connection pad are provided in an integrated manner, and a width (W1) of the connection pad is formed so as to be greater than a width (W2) of the wiring pattern (W1W2).
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