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Method for injection molding for epoxy resin moldings and an injection moldable epoxy resin composition

机译:用于环氧树脂模制件的注塑方法和可注塑模制的环氧树脂组合物

摘要

Disclosed is a method of injection-molding for epoxy resin moldings wherein an epoxy resin composition is used as starting material, a molding cycle is shortened, a continuous molding operation is possible and a waste portion after curing can be minimized as well as an injection-moldable epoxy resin composition excellent in thermal stability possessing latent-type curing characteristics capable of rapidly promoting curing reaction in a metal mold without being cured in an injection molding machine.;The aforesaid method is carried out by charging an epoxy resin composition possessing the latent-type curing characteristics into a mini-sprue metal mold which is composed of a manifold part, a mini-sprue part and an ejector-plate part and wherein a metal mold temperature at the manifold part is so maintained that the epoxy resin composition is molten but curing of the composition is not promoted, and injection-molding the composition.
机译:公开了一种用于环氧树脂模制件的注射模制方法,其中,环氧树脂组合物用作起始材料,缩短了模制周期,可以进行连续模制操作并且可以将固化后的废料部分最小化,以及具有优异的热稳定性,具有潜在型固化特性的可模塑环氧树脂组合物,能够在注射成型机中快速固化而无需在注射成型机中固化即可快速促进金属模具中的固化反应。在由歧管部分,微型浇口部分和顶出板部分组成的微型浇口金属模具中具有两种类型的固化特性,并且保持歧管部分的金属模具温度保持环氧树脂组合物熔融但不促进组合物的固化,并且将组合物注塑。

著录项

  • 公开/公告号US6231800B1

    专利类型

  • 公开/公告日2001-05-15

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS;

    申请/专利号US19990348073

  • 发明设计人 EIKI TOGASHI;TSUKASA SAKURABA;

    申请日1999-07-06

  • 分类号B29C450/00;B29C452/70;B29C457/30;

  • 国家 US

  • 入库时间 2022-08-22 01:04:19

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