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Method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition

机译:用于环氧树脂模制件的注射成型方法和可注射成型的环氧树脂组合物

摘要

Provided is a method of injection-molding for epoxy resin moldings wherein an epoxy resin composition is used as starting material, a molding cycle is shortened, a continuous molding operation is possible and a waste portion after curing can be minimized as well as an injection-moldable epoxy resin composition excellent in thermal stability possessing latent-type curing characteristics capable of rapidly promoting curing reaction in a metal mold without being cured in an injection molding machine. The aforesaid method is carried out by charging an epoxy resin composition possessing the latent-type curing characteristics into a mini-sprue mold which is composed of a manifold part, a mini-sprue part and an ejector-plate part and wherein a mold temperature at the manifold part is so maintained that the epoxy resin composition is molten but curing of the composition is not promoted, and injection-molding the composition.
机译:提供了一种用于环氧树脂模制件的注射模制方法,其中环氧树脂组合物用作起始材料,缩短了模制周期,可以进行连续模制操作并且可以将固化后的废料部分最小化,以及具有优异的热稳定性的可模制环氧树脂组合物,具有潜在型固化特性,能够在注射模制机中快速固化而无需在模具中快速固化。上述方法是通过将具有潜伏型固化特性的环氧树脂组合物装入由歧管部分,微型浇口部分和顶出板部分组成的微型浇口模具中进行的,其中模具温度为保持歧管部分使得环氧树脂组合物熔融但不促进该组合物的固化,并注塑该组合物。

著录项

  • 公开/公告号SG52980A1

    专利类型

  • 公开/公告日2000-04-18

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS INC.;

    申请/专利号SG19970001782

  • 发明设计人 TOGASHI EIKI;SAKURABA TSUKASA;

    申请日1997-05-29

  • 分类号B29C45/00;C08L63/00;

  • 国家 SG

  • 入库时间 2022-08-22 01:54:50

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