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Inspection system and method for bond detection and validation of surface mount devices using sensor fusion and active perception
Inspection system and method for bond detection and validation of surface mount devices using sensor fusion and active perception
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机译:使用传感器融合和主动感知的表面检测装置的结合检测和验证的检查系统和方法
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摘要
A hybrid surface mount component inspection system which includes both vision and infrared inspection techniques to determine the presence of surface mount components on a printed wiring board, and the quality of solder joints of surface mount components on printed wiring boards by using data level sensor fusion to combine data from two infrared sensors to obtain emissivity independent thermal signatures of solder joints, and using feature level sensor fusion with active perception to assemble and process inspection information from any number of sensors to determine characteristic feature sets of different defect classes to classify solder defects.
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