首页> 外国专利> Testing sterile packaged components of an implantable medical device prior to chronic implantation

Testing sterile packaged components of an implantable medical device prior to chronic implantation

机译:在长期植入之前测试植入式医疗设备的无菌包装组件

摘要

Apparatus, systems and methods for coupling components of an implantable medical device that are contained within separate sterile packages together and testing operation thereof prior to chronic implantation are disclosed. In particular, testing of the integrity of the lead conductors and other electrical components coupled therewith and the testing and calibration of an implantable sensor, e.g., an implantable pressure sensor, coupled to a programmable, implantable hemodynamic monitor (IHM) or implantable pulse generator (IPG) while in respective sterile packages are disclosed. The lead and IPG/IHM sterile packages are provided with package connectors that couple the terminals of the IPG/IHM and lead to external package connector arrays. The package connector arrays are coupled together, and a programmer is employed to downlink telemetered commands to the IPG or IHM to test the sensor and/or lead conductors and uplink via telemetery the results to the programmer for display. When a lead borne pressure sensor is under test, the uplink telemetered pressure readings are compared to a reference pressure reading. A correction factor is determined if the uplink telemetered and reference pressure readings differ, and the correction factor is downlink telemetered from the programmer into memory of the IPG or IHM for use in adjusting the sensor pressure readings. The pressure test may be conducted both at atmospheric pressure and at elevated pressures correlated to typical systolic blood pressures, and the correction factor may be derived from all tests.
机译:公开了用于将包含在分开的无菌包装中的可植入医疗装置的部件耦合在一起并在慢性植入之前测试其操作的装置,系统和方法。具体而言,测试导线导体和与其耦合的其他电气组件的完整性,以及测试和校准与可编程,可植入血液动力学监视器(IHM)或可植入脉冲发生器耦合的可植入传感器(例如可植入压力传感器)(公开了分别在无菌包装中的IPG。引线和IPG / IHM无菌包装随附有包装连接器,该包装连接器将IPG / IHM的端子耦合到外部包装连接器阵列。封装连接器阵列耦合在一起,并使用编程器将遥测的命令下行到IPG或IHM以测试传感器和/或导线,并通过遥测将结果上行到编程器以进行显示。在测试含铅压力传感器时,会将上行链路遥测压力读数与参考压力读数进行比较。如果上行链路遥测和参考压力读数不同,则确定校正因子,并且从编程器将下行链路遥测校正因子到IPG或IHM的内存中,以用于调整传感器压力读数。压力测试既可以在大气压下进行,也可以在与典型收缩压相关的高压下进行,校正因子可以从所有测试中得出。

著录项

  • 公开/公告号US6292697B1

    专利类型

  • 公开/公告日2001-09-18

    原文格式PDF

  • 申请/专利权人 MEDTRONIC INC.;

    申请/专利号US20000504596

  • 发明设计人 JONATHAN P. ROBERTS;

    申请日2000-02-15

  • 分类号A61N13/70;

  • 国家 US

  • 入库时间 2022-08-22 01:03:17

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