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Ultrahigh molecular weight polyethylene composite material for etched circuit baseplate and antenna fundamental material
Ultrahigh molecular weight polyethylene composite material for etched circuit baseplate and antenna fundamental material
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机译:用于蚀刻电路基板的超高分子量聚乙烯复合材料和天线基础材料
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(57) Abstract The ultrahigh molecular weight polyethylene (UHMWPE) composite material (12) in order to use for the etched circuit baseplate or the antenna fundamental material. The fundamental material at least one which consists of the ultrahigh molecular weight polyethylene composite material (12) induced electricity layer and, includes with one which consists of the electric conduction substance electric conduction layer (16) at least, induced electricity layer and electric conduction layer have glued mutually closely.
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