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Ultrahigh molecular weight polyethylene composite material for etched circuit baseplate and antenna fundamental material

机译:用于蚀刻电路基板的超高分子量聚乙烯复合材料和天线基础材料

摘要

(57) Abstract The ultrahigh molecular weight polyethylene (UHMWPE) composite material (12) in order to use for the etched circuit baseplate or the antenna fundamental material. The fundamental material at least one which consists of the ultrahigh molecular weight polyethylene composite material (12) induced electricity layer and, includes with one which consists of the electric conduction substance electric conduction layer (16) at least, induced electricity layer and electric conduction layer have glued mutually closely.
机译:(57)<摘要>超高分子量聚乙烯(UHMWPE)复合材料(12)用于蚀刻电路基板或天线基础材料。基本材料中的至少一种由超高分子量聚乙烯复合材料(12)构成的感应电层,并且包括至少一种由导电物质构成的导电层(16),感应电层和导电层相互紧密地粘合在一起。

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