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Leveling meting face measurement manner and exposure device

机译:水准面测量方式及曝光装置

摘要

PURPOSE:To measure the amount of inclination of the levelling mating plane against the best image formation plane in a highly precise and speedy manner without using a special superflat wafer. CONSTITUTION:On the first exposure region 32 on which focal position is provided on the first focal position wherein a levelling mechanism is in operation, five focal-point measuring mask image (ULA, etc.) are exposed on shot regions 33A to 33G which are partially overlapped, and also five focal-point measuring mask images are exposed on the partially overlapped shot region on the exposure regions 34, 36... where the focal position is changed. The best focal position is calculated using the average value of the mask length of mask images ULA to ULG and the mask length of the mark image of the measuring point on the upper left of the first focal position.
机译:用途:无需使用特殊的超平晶片,即可以高精度和快速的方式测量调平配合平面相对于最佳成像平面的倾斜度。构成:在第一焦点位置上提供焦点位置的第一曝光区域32上,在该焦点上操作了调平机构,五个焦点测量掩模图像(ULA等)被曝光在拍摄区域33A至33G上,部分重叠,并且五个焦点测量掩模图像也在改变了焦点位置的曝光区域34、36 ...上的部分重叠的拍摄区域上曝光。使用掩模图像ULA至ULG的掩模长度的平均值和在第一焦点位置的左上角的测量点的标记图像的掩模长度来计算最佳焦点位置。

著录项

  • 公开/公告号JP3271348B2

    专利类型

  • 公开/公告日2002-04-02

    原文格式PDF

  • 申请/专利权人 株式会社ニコン;

    申请/专利号JP19930004866

  • 发明设计人 高根 栄二;蛭川 茂;

    申请日1993-01-14

  • 分类号H01L21/027;G03F7/20;

  • 国家 JP

  • 入库时间 2022-08-22 01:01:30

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