首页> 外国专利> HOLDER AND HOLDING METHOD FOR SHEET-LIKE MEASURED OBJECT, INSPECTION DEVICE AND INSPECTION METHOD FOR CUT FACE OF QUARTZ PLATE, AND MEASURING INSTRUMENT AND MEASURING METHOD FOR FLATNESS OF SHEET-LIKE MEASURED OBJECT

HOLDER AND HOLDING METHOD FOR SHEET-LIKE MEASURED OBJECT, INSPECTION DEVICE AND INSPECTION METHOD FOR CUT FACE OF QUARTZ PLATE, AND MEASURING INSTRUMENT AND MEASURING METHOD FOR FLATNESS OF SHEET-LIKE MEASURED OBJECT

机译:片状被测物的保持和保持方法,石英板切割面的检查装置和检查方法,片状被测物的平坦度的测量仪器和测量方法

摘要

PROBLEM TO BE SOLVED: To properly measure or inspect a sheet-like measured object with high accuracy at all times by supporting the object in a proper posture to prevent a deformation such as warp, in the case of non-contact measurement or inspection.;SOLUTION: This holder having a rectangular block-shaped wafer support pedestal 20 is provided with an oval recessed portion 21 on its upper surface, and a water supplying/ draining port 22 opened in the middle of the bottom surface of the recessed portion is connected to a pump 23 and a feed water tank 24 via a pipeline. When it is used, a quartz wafer is disposed on the bottom surface of the recessed portion, and a prescribed amount of water 25, preferably pure water, is infused thereinto to float the quartz wafer on the surface of water by its surface tension. In this state of things, the inclination angle of a cut face of the quartz wafer and the flatness of its surface, for example, are measured, then the water is drained from the recessed portion by reversely rotating the pump, and the quartz wafer is taken out. If the bottom surface of the recessed portion is formed into a wave-shaped surface 29, the quartz wafer can be easily taken out since it is in no danger of sticking to the bottom surface owing to the surface tension of water when the water is drained.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:在非接触式测量或检查的情况下,通过以适当的姿势支撑物体以防止变形(例如翘曲),可以始终正确地正确测量或检查片状被测物;解决方案:该具有矩形块状晶片支撑基座20的支架在其上表面设有一个椭圆形的凹入部分21,并且在凹入部分的底表面的中间开口的给水/排水口22连接到泵23和给水箱24通过管道。在使用时,将石英晶片放置在凹入部分的底表面上,并向其中注入规定量的水25,优选纯水,以使石英晶片通过其表面张力浮在水面上。在这种状态下,例如,测量石英晶片切割面的倾斜角度及其表面的平整度,然后通过反向旋转泵将水从凹入部分中排出,石英晶片带走。如果将凹部的底面形成为波浪状的面29,则由于不存在因排水时的水的表面张力而附着于底面的危险,因此容易取出石英晶片。 。;版权:(C)2002,日本特许厅

著录项

  • 公开/公告号JP2002168739A

    专利类型

  • 公开/公告日2002-06-14

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20000363611

  • 发明设计人 NAKAGAWA TETSUO;SHIRAISHI SHIGERU;

    申请日2000-11-29

  • 分类号G01N1/28;G01B11/30;G01N23/207;

  • 国家 JP

  • 入库时间 2022-08-22 00:59:18

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