METHOD FOR DECREASING PROBLEMS RELATED TO RECESSED PLANE FORMATION DURING TRENCH INSULATING STRUCTURE FORMATION

摘要

PROBLEM TO BE SOLVED: To fabricate a trench insulating structure having substantially flat surface.;SOLUTION: A void (14) of a trench (4) is filled with a silicon film, and the silicon film is polished as deposited or after oxidizing, thereby, forming a trench insulating structure having a flat upper surface.;COPYRIGHT: (C)2002,JPO