NON-LEAD PLASTIC SEMICONDUCTOR PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To improve the junction strength with a printed circuit board at the soldering section of a surface-mounting non-lead package.;SOLUTION: In the non-lead plastic semiconductor package structure, the electrode section of a semiconductor chip 4 is connected to a lead 23 used for external connection by a conductor 5 for molding by plastic 1, and an electrode pad on the printed circuit board is soldered and bonded to the lead 23. In this case, a lower surface at the middle section of the lead 23 is exposed from the molded plastic 1 from a soldering section 6 of the lead to a fixed height inside the package body of the plastic 1.;COPYRIGHT: (C)2002,JPO