首页> 外国专利> METHOD AND DEVICE FOR ADHERING SUBSTRATE IN LIQUID CRYSTAL CELL MANUFACTURING PROCESS

METHOD AND DEVICE FOR ADHERING SUBSTRATE IN LIQUID CRYSTAL CELL MANUFACTURING PROCESS

机译:在液晶细胞制造过程中附着基质的方法和装置

摘要

PROBLEM TO BE SOLVED: To provide a method for adhering substrates suitable for manufacturing of a large sized liquid crystal cell.;SOLUTION: In the method for adhering a pair of substrates to each other with a prescribed call gap in a liquid crystal cell manufacturing process, (a) stuck substrates (1) having a spacer and an uncured thermosetting sealing material interposed between the pair of substrates are placed on a surface plate (2) and a flexible cover (3) is disposed on the surface plate 2, so as to cover the stuck substrate (1) to form a closed space (4) for housing the stuck substrates (1); (b) the closed space (4) is evacuated to press the stuck substrates (1) against the surface plate (2) via the cover (3) by the peripheral pressure; (c) the stuck substrates (1) are heated by heating means (4, 5) in a condition with the stuck substrates (1) being pressed against the surface plate (2) to cure the sealing material between the stuck substrates thermally; (d) the stuck substrates (1) are cooled by cooling means (7, 8) while maintaining the condition that the stuck substrates (1) are pressed against the surface plate (2) to adhere the stuck substrates to each other with the prescribed gap. The surface plate (2) is maintained in the same position during the stages of from (a) through (d).;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种用于粘附适于制造大型液晶单元的基板的方法。解决方案:在液晶单元的制造过程中以预定的间隙将一对基板彼此粘附的方法(a)将粘贴有间隔物和未固化的热固性密封材料插入在一对基板之间的基板(1)放置在面板(2)上,并在面板2上放置柔性盖(3),从而覆盖粘附的基板(1)以形成用于容纳粘附的基板(1)的封闭空间(4); (b)排空封闭空间(4),以通过周边压力通过盖(3)将粘附的基板(1)压向面板(2)。 (c)在加热状态下,通过加热装置(4、5)加热粘附的基板(1),使粘附的基板(1)压在面板(2)上,以热固化粘附的基板之间的密封材料; (d)通过保持装置将粘附的基板(1)压在面板(2)上以规定的方式将粘附的基板彼此粘附的条件,通过冷却装置(7、8)冷却粘附的基板(1)。间隙。在(a)到(d)的阶段中,面板(2)保持在同一位置。;版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002082342A

    专利类型

  • 公开/公告日2002-03-22

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC IND CO LTD;

    申请/专利号JP20000271463

  • 发明设计人 ISHIO HIROAKI;

    申请日2000-09-07

  • 分类号G02F1/1339;G09F9/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:57:21

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