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METHOD FOR REMOVAL OF SURFACE ROUGHNESS OF METAL WIRING AND METHOD FOR FORMATION OF METAL WIRING ONTO TFT ARRAY
METHOD FOR REMOVAL OF SURFACE ROUGHNESS OF METAL WIRING AND METHOD FOR FORMATION OF METAL WIRING ONTO TFT ARRAY
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机译:在TFT阵列上去除金属线表面粗糙度的方法和形成金属线的方法
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摘要
PROBLEM TO BE SOLVED: To effectively remove surface roughness formed on the surface of a metal wring after a wet etching operation in a semiconductor manufacturing process.;SOLUTION: A tetramethylammonium hydroxide(TMAH) solution is applied to the rough surface of the metal wiring, and it is placed still for a prescribed time. After that, the metal interconnection is cleaned, and the TMAH solution left on the surface of the metal wiring is removed.;COPYRIGHT: (C)2002,JPO
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