ALUMINA TYPE GRINDING WHEEL, DIAMOND TYPE GRINDING WHEEL AND CUTTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of substantially perfectly removing a bonding material adhering to a target of a spent sputtering target from which a backing plate is detached.;SOLUTION: This alumina type grinding wheel or diamond type grinding wheel for removing the bonding material adhering to the spent sputtering target has 30-48% abrasive grain rate, 7-15% binder rate, and 45-63% porosity. When the spent sputtering target contains at least one kind selected from Au, Ag, Ir, Ru, Tb, Ge and Gd, this cutting method is effective.;COPYRIGHT: (C)2002,JPO