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CONNECTION STRUCTURE FOR PLANE TRANSMISSION LINE, AND SEMICONDUCTOR CHIP HAVING THE PLANE TRANSMISSION LINE AND MOUNT BOARD
CONNECTION STRUCTURE FOR PLANE TRANSMISSION LINE, AND SEMICONDUCTOR CHIP HAVING THE PLANE TRANSMISSION LINE AND MOUNT BOARD
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机译:平面传输线的连接结构,以及具有平面传输线和安装板的半导体芯片
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摘要
PROBLEM TO BE SOLVED: To connect plane transmission lines formed on two dielectric materials with different dielectric constants. SOLUTION: In the case of connecting the plane transmission lines formed on two dielectric materials with different dielectric constants, a dielectric material thin film is formed only in the vicinity of the connected part and a line pattern is formed on the thin film. Thus, the effective dielectric constant of the connected part can be adjusted to have a desired value so as to relax a scale gap between the line on the mounted board and the line on a semiconductor chip. Thus, the impedance is easily matched to adopt a connection structure with a low reflection and a low loss.
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