SURFACE ACOUSTIC WAVE FILTER AND PACKAGE CONTAINING THE SURFACE ACOUSTIC WAVE FILTER

摘要

PROBLEM TO BE SOLVED: To provide a surface acoustic wave filter adopting a structure that can prevent an interdigital electrode pattern from being damaged due to electric arc charging of the charges on a chip substrate caused by polarization when the surface acoustic wave filter is mounted on the substrate or tested or the like.;SOLUTION: A GND terminal 74 is extended to the inside of a package 7 and has a part extended laterally (laterally extended part) from the extended part (longitudinal extension part). The longitudinal extended part and the laterally extended part of the GND terminal 74 form a metal-made plate part 80 exposed in an internal groove 78 of the package 7. In the case of containing the surface acoustic wave filter 100 in the package 7, the surface acoustic wave filter 100 is placed on the groove 78 of the package 7 so that the rear side of the chip substrate is in contact with the plate part 80.;COPYRIGHT: (C)2002,JPO