首页> 外国专利> ELECTRICAL INSULATING RESIN COMPOSITION, COPPER-FOILED ELECTRICAL INSULATING MATERIAL AND COPPER-CLAD LAMINATED BOARD

ELECTRICAL INSULATING RESIN COMPOSITION, COPPER-FOILED ELECTRICAL INSULATING MATERIAL AND COPPER-CLAD LAMINATED BOARD

机译:电绝缘树脂组合物,铜发泡电绝缘材料和覆铜箔层压板

摘要

PROBLEM TO BE SOLVED: To provide the subject resin composition flame-retardative without using any halogen-based flame retardant, capable of making non-halogen-based flame-retardant copper-foiled electrical insulating materials, and also excellent in heat resistance and reliability, and to obtain such copper-foiled electrical insulating materials and copper-clad laminated boards each excellent in flame retardancy, heat resistance and reliability and capable of responding to the demand for environmental compatibility by using the above resin composition.;SOLUTION: This resin composition essentially comprises an epoxy resin, an epoxy resin curing agent, electrical insulating whisker, metal hydroxide(s) and a multiple oxide of flame-retarding auxiliary.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:为了提供不使用任何卤素基阻燃剂的目标树脂组合物阻燃性,能够制造非卤素基阻燃铜箔电绝缘材料,并且还具有优异的耐热性和可靠性,并通过使用上述树脂组合物获得阻燃性,耐热性和可靠性均优异并且能够满足环境相容性要求的此类铜箔电绝缘材料和覆铜层压板。包括环氧树脂,环氧树脂固化剂,电绝缘晶须,金属氢氧化物和多种阻燃助剂的氧化物。版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001316563A

    专利类型

  • 公开/公告日2001-11-16

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP20000134258

  • 发明设计人 OGAWA NOBUYUKI;HORIUCHI TAKESHI;

    申请日2000-04-28

  • 分类号C08L63/00;C08G59/44;C08G59/62;C08K3/22;C08K3/24;C08K3/38;C08K5/521;H01B3/40;

  • 国家 JP

  • 入库时间 2022-08-22 00:56:11

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