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CAMERA TO BE MOUNTED ON BOARD, AND METHOD OF MOUNTING THE CAMERA ONTO BOARD

机译:待安装在板上的照相机以及将照相机安装到板上的方法

摘要

PROBLEM TO BE SOLVED: To provide a camera to be mounted on a board and a method for mounting the camera onto the mount board, by which the camera can be mounted efficiently on a printed circuit board. SOLUTION: In the mounting method for the camera mounted on the board, by which a camera module consisting of a CCD area sensor 11 and a lens 16 onto a printed circuit board 1 of an information terminal such as a mobile phone, the camera module is designed separately to be a board module 5, where the CCD area sensor 11 is mounted on a sub board 10 and to be a lens module 6, where a lens case 15 supports the lens 16, and only the board module 5 is mounted on the printed circuit board 1 by the same process as mount of other electronic components. Then the lens module 6 is mounted on the sub board 10 and fixed thereon. Thus, the heating can be carried out in a state with the low heat-resistant components, such as the lens 16, being eliminated and manual soldering for the camera module having conventionally been required can be avoided, so as to improve the productivity.
机译:解决的问题:提供一种照相机,该照相机可以安装在板上,并且可以将照相机安装到安装板上,从而可以将照相机有效地安装在印刷电路板上。解决方案:在将照相机安装在板上的安装方法中,将由CCD区域传感器11和镜头16组成的照相机模块安装到信息终端(例如手机)的印刷电路板1上,该照相机模块就是单独设计为板模块5,其中CCD区域传感器11安装在子板10上,以及透镜模块6,其中透镜盒15支撑透镜16,仅板模块5安装在面板上。印刷电路板1与其他电子部件的安装方法相同。然后,将镜头模块6安装在子基板10上并固定在其上。因此,可以在消除了诸如透镜16之类的低耐热性部件的状态下进行加热,并且可以避免传统上需要对照相机模块进行手动焊接,从而提高了生产率。

著录项

  • 公开/公告号JP2002185826A

    专利类型

  • 公开/公告日2002-06-28

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC IND CO LTD;

    申请/专利号JP20000381885

  • 发明设计人 MATSUKI TOSHIHIRO;

    申请日2000-12-15

  • 分类号H04N5/225;G03B17/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:55:43

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