ELECTRONIC COMPONENT EXHIBITING EXCELLENT UNIFORMITY IN PLATING FILM THICKNESS AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component exhibiting excellent uniformity in the plating film thickness and its manufacturing method.;SOLUTION: The electronic component has a plurality of external electrodes formed on a basic ceramic body wherein the external electrode comprises an underlying layer formed on the basic ceramic body, and a conductor layer formed on the surface of the underlying layer by electroplating. Standard deviation in the film thickness distribution of the conductor layer is 15 μm or less.;COPYRIGHT: (C)2002,JPO