SN-AG-CU-BI-BASE SOLDER FOR ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide solder for an electronic instrument having improved mechanical strength.;SOLUTION: This solder consists of 1 to 3 mass % Ag, 0.5 to 1.0 mass % Cu, 10 to 20 mass % Bi, 0.01 to 0.03 mass % Ge or 0.01 to 0.1 mass % Se and the balance Sn.;COPYRIGHT: (C)2001,JPO