首页> 外国专利> ALKOXY GROUP-CONTAINING SILANE MODIFIED POLYAMIC ACID RESIN COMPOSITION AND POLYIMIDE-SILICA HYBRID CURED MATERIAL

ALKOXY GROUP-CONTAINING SILANE MODIFIED POLYAMIC ACID RESIN COMPOSITION AND POLYIMIDE-SILICA HYBRID CURED MATERIAL

机译:含烷氧基的硅烷改性的聚丙烯酸酯树脂组合物和聚酰亚胺-二氧化硅混合固化材料

摘要

PROBLEM TO BE SOLVED: To obtain an alkoxy group-containing silane modified polyamide acid resin composition capable of providing a cured material having excellent mechanical strength and heat resistance, and a transparent polyimide-silica hybrid cured material having excellent heat resistance, mechanical strength and insulation properties and causing no warpage, nor crack.;SOLUTION: This silane modified polyamic acid resin composition is characterized by comprising an alkoxy group-containing silane modified polyamide acid resin obtained by reacting a polyamic acid with an epoxy group-containing alkoxysilane partial condensate prepared by subjecting an epoxy compound containing one hydroxy group in one molecule and an alkoxysilane partial condensate to a dealcoholization reaction and a polar solvent.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:获得能够提供具有优异的机械强度和耐热性的固化材料的含烷氧基的硅烷改性聚酰胺酸树脂组合物,以及具有优异的耐热性,机械强度和绝缘性的透明聚酰亚胺-二氧化硅杂化固化材料。该硅烷改性的聚酰胺酸树脂组合物的特征在于,其包含通过使聚酰胺酸与通过以下方法制备的含环氧基的烷氧基硅烷部分缩合物反应而获得的含烷氧基的硅烷改性聚酰胺酸树脂。使一个分子中含有一个羟基的环氧化合物与烷氧基硅烷部分缩合物进行脱醇反应和极性溶剂。;版权所有:(C)2002,日本特许厅

著录项

  • 公开/公告号JP2002293933A

    专利类型

  • 公开/公告日2002-10-09

    原文格式PDF

  • 申请/专利权人 ARAKAWA CHEM IND CO LTD;

    申请/专利号JP20010238729

  • 发明设计人 TONO TETSUJI;AIDA HIDEKI;

    申请日2001-08-07

  • 分类号C08G73/10;C08K3/36;C08L79/08;C09D179/08;C09J179/08;H01L21/312;H01L21/60;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:57

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