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ELECTRONIC EQUIPMENTS, COUPLING INSTRUMENT OF ELECTRONIC EQUIPMENTS AND COUPLING STRUCTURE OF ELECTRONIC EQUIPMENTS

机译:电子设备,电子设备的耦合装置和电子设备的耦合结构

摘要

PROBLEM TO BE SOLVED: To provide the coupling structure of electronic equipments, which simplifies the works for a mechanical coupling of the electronic equipments and the electrical connection of the electronic equipments and also can prevent connecting cables from being exposed, and to provide a coupling instrument of the electronic equipments and the electronic equipments.;SOLUTION: The coupling structure of electronic equipments has the electronic equipment 1, which has an engaging groove 1 and a signal terminal 13 provided in the groove 11, the electronic equipment 2, which has an engaging groove 20 and a signal terminal 22 provided in the groove 20, and a coupling instrument 3, which is provided with a frame member 3a, which is simultaneously fitted in both of the grooves 11 and 20 when the equipments 1 and 2 are arranged side by side, and a conductor 3d, which electrically connects the terminals 13 and 22 with each other in contact with the terminals 13 and 22.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:提供电子设备的耦合结构,这简化了电子设备的机械耦合和电子设备的电连接的工作,并且还可以防止连接电缆裸露,并且提供了一种耦合仪器解决方案:电子设备的耦合结构具有电子设备1和电子设备2,其中电子设备1具有啮合槽1和设置在槽11中的信号端子13,电子设备2具有啮合槽。槽20和设置在槽20中的信号端子22,以及耦合仪器3,其具有框架构件3a,当设备1和2并排布置时,框架3a同时装配在两个沟槽11和20中侧面;和导体3d,其使端子13和22相互电连接并与端子13和22接触;版权:(C)200 1,日本特许厅

著录项

  • 公开/公告号JP2001352180A

    专利类型

  • 公开/公告日2001-12-21

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP20000173130

  • 发明设计人 MURAI DAIJI;

    申请日2000-06-09

  • 分类号H05K5/02;G11B33/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:49

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