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DIAPHRAGM STRUCTURE, MICRO-TRANSDUCER AND THEIR MANUFACTURING METHOD

机译:隔膜结构,微传感器及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a diaphragm structure having a high yield, a micro- transducer and a method for manufacturing them.;SOLUTION: The method for manufacturing the diaphragm structure comprises the steps of forming body parts 30A and 30B and diaphragms 31A and 31B of diaphragm constituting elements by using a normal semiconductor process on first and second substrates 1A and 1B via a mold release layer 2. The method further comprises the steps of connecting and transferring the parts 30A and 30B to a target substrate 11, connecting and transferring the diaphragms 31A and 31A to the parts 30A and 30B. Thus, the diaphragm structure in which a cavity is formed between the substrate 11 and the diaphragms 31A, 31B is completed.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:为了提供具有高成品率的膜片结构,微换能器及其制造方法。解决方案:用于制造膜片结构的方法包括形成主体部分30A和30B以及膜片31A和31A的步骤。通过使用常规半导体工艺经由脱模层2在第一和第二基板1A和1B上形成膜片构成元件31B,该方法还包括以下步骤:将部件30A和30B连接并传送到目标基板11,连接并传送隔膜31A和31A到部分30A和30B。由此,完成了在基板11与振动板31A,31B之间形成有空洞的振动板结构。版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002043584A

    专利类型

  • 公开/公告日2002-02-08

    原文格式PDF

  • 申请/专利权人 FUJI XEROX CO LTD;

    申请/专利号JP20000227343

  • 发明设计人 TAKAHASHI MUTSUYA;YAMADA TAKAYUKI;

    申请日2000-07-27

  • 分类号H01L29/84;B81B3/00;B81C1/00;G01L9/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:21

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