首页>
外国专利>
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
展开▼
机译:电解研磨装置,电解研磨方法以及被研磨的晶片
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The electrolytic polishing apparatus may also include a termination point detecting portion for detecting a termination point of polishing by reading a variation of the resistance value measured by the resistance measuring unit, or a polishing control portion for terminating electrolytic polishing on the basis of the termination point of polishing detected by the termination point detecting portion.
展开▼