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Structure comprising a binder layer non-delaminable with respect to a metallized substrate and peelable with respect to a polyropylene substrate

机译:包括相对于金属化基材不可剥离且可相对于聚对二甲苯基材剥离的粘合剂层的结构

摘要

A multilayer structure of, in succession, a metal layer or a metallized-substrate layer, a layer of a polypropylene-based binder extrusion-coated at a rate of more than 100 m/min. and optionally a polypropylene layer, the metal or metallized layer and the binder layer being made non-delaminable by heat treating the structure. The extrudable binder contains by weight: (A) 5 to 30% of a copolymer of ethylene and one or more comonomers chosen from the group of carboxylic acid esters, vinyl esters and dienes in particular the ethylene/alkyl (meth)acrylate/maleic anhydride terpolymer; (B) 40 to 93% of a stretchable polypropylene; and (C) 2 to 30% of a polypropylene functionalized by an unsaturated carboxylic acid anhydride, especially maleic anhydride; the MFI of the composition being between 10 and 50 g/10 min. (at 230° C./2.16 kg). the multi-layer structure is useful for the production of packages.
机译:依次为金属层或金属化基材层,以大于100 m / min的速度挤出涂覆的聚丙烯类粘合剂层的多层结构。任选地,通过对结构进行热处理,使聚丙烯层,金属或金属化层和粘合剂层不可脱层。可挤出的粘合剂包含按重量计:(A)5-30%的乙烯和一种或多种选自羧酸酯,乙烯基酯和二烯的共聚单体的共聚物,特别是乙烯/(甲基)丙烯酸烷基酯/马来酸酐三元共聚物(B)40至93%的可拉伸聚丙烯; (C)被不饱和羧酸酐,特别是马来酸酐官能化的聚丙烯的2-30%;组合物的MFI为10至50g / 10min。 (在230℃/ 2.16kg下)。多层结构对于包装的生产很有用。

著录项

  • 公开/公告号US2002034649A1

    专利类型

  • 公开/公告日2002-03-21

    原文格式PDF

  • 申请/专利权人 ATOFINA;

    申请/专利号US20010821796

  • 发明设计人 PATRICE PERRET;YVES LE DU;

    申请日2001-03-30

  • 分类号B32B15/08;

  • 国家 US

  • 入库时间 2022-08-22 00:52:06

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