首页> 外国专利> Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds

Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds

机译:苯乙烯-马来酸酐共聚物与多官能胺化合物交联的环氧树脂共混物

摘要

A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.
机译:公开了一种树脂共混物,其包括苯乙烯和马来酸酐(SMA)的共聚物,环氧树脂(溴化,膦化或无溴)和多官能胺交联剂。交联剂通常包含至少两个伯氨基,以在与SMA共聚物的酸酐部分反应时促进酰亚胺官能团的形成。特别有用的交联剂包括以三嗪为中心的二氨基和三氨基化合物,例如苯并胍胺,乙酰胍胺和三聚氰胺。发现所公开的树脂共混物在复合材料中用作聚合物基质,并在层压板中用作浸渍树脂。与常规的SMA共聚物/环氧树脂共混物相比,所公开的树脂表现出较低的介电常数和耗散因数,以及较高的耐热性和耐湿性,使其特别适用于高速,低损耗的印刷线路板应用。

著录项

  • 公开/公告号US2002006515A1

    专利类型

  • 公开/公告日2002-01-17

    原文格式PDF

  • 申请/专利权人 LUTTRULL DAVID K.;

    申请/专利号US20010818028

  • 发明设计人 DAVID K. LUTTRULL;

    申请日2001-03-27

  • 分类号B32B15/08;

  • 国家 US

  • 入库时间 2022-08-22 00:50:23

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