Grounding scheme for a high speed backplane connector system

摘要

A modular electrical connector comprising a plurality of wafers and shielding plates, each wafer having an insulative housing and a plurality of contact elements extending therethrough, the wafer having two side surfaces with slots formed therethrough to isolate each adjacent pair of contact elements within the wafer, each shielding plate having a plurality of ribs extending outwardly from at least one of two side surfaces thereof and being mounted between two adjacent wafers with each rib fitted within a corresponding slot to shield each adjacent pair of contact elements.