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Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias
Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias
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机译:设计和组装方法,用于减少将电子组件绑定到与通孔相连的焊盘上的桥接
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摘要
An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface such that at least one of the one or more solder pad centers is offset from the connecting via center and an area of the at least one of the one or more solder pads overlaps an area of the connecting via.
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