Bonding member and gypsum board mounting method using the same

摘要

A bonding member 1 comprising a metallic plate 2 formed as a small piece onto which a hot melt adhesive layer 3 is formed at least one side of said metallic plate 2, and a gypsum board mounting method for mounting a gypsum board 5 using the bonding member 1, comprising: fixing said bonding member 5 temporarily; pushing said gypsum board 5, heating the metallic plate 2 with electromagnetic induction to melt said hot melt adhesive layer 3; and thereby allowing the gypsum board 5 to be bonded easily without noise. The bonded gypsum board 5 can be recycled because it can be peeled off easily with melting the adhesive layer 3 without damage of the board.