首页> 外国专利> Ground bounce reduction technique using phased outputs and package de-skewing for synchronous buses

Ground bounce reduction technique using phased outputs and package de-skewing for synchronous buses

机译:降低接地弹跳技术,使用相控输出和封装去偏斜同步总线

摘要

A technique for reducing such ground bounce using phased outputs and package de-skewing for source synchronous buses is described. In one embodiment, the output buffers of an integrated circuit (“IC”) are phased so that half of the buffer outputs are driven first and the remaining half are driven a slight time delay later. The outputs are then de-skewed by package routing so that the earlier signals reach the package pins at the same time as the later signals. This deskewing is accomplished by serpentining and length-matching the bank of non-delayed outputs so that these trace-induced delays match an optimized fixed clock delay used to delay the bank of delayed outputs, the traces of which are length-matched and routed as short as possible.
机译:描述了一种使用相控输出和源同步总线的封装去偏斜来减少这种接地反弹的技术。在一个实施例中,集成电路(“ IC”)的输出缓冲器被定相,使得缓冲器输出的一半首先被驱动,而其余的一半随后被稍微延迟地驱动。然后,通过封装布线对输出进行偏斜校正,以便较早的信号与较晚的信号同时到达封装引脚。通过对非延迟输出的组进行蛇形化和长度匹配来实现这种去偏斜,以便这些迹线引起的延迟与用于延迟延迟输出组的优化的固定时钟延迟匹配,该迹线是长度匹配的并按如下方式布线尽可能短。

著录项

  • 公开/公告号US6356100B1

    专利类型

  • 公开/公告日2002-03-12

    原文格式PDF

  • 申请/专利权人 DELL PRODUCTS L.P.;

    申请/专利号US20010766181

  • 申请日2001-01-19

  • 分类号H03K171/80;

  • 国家 US

  • 入库时间 2022-08-22 00:49:55

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