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Method of growing a thin film in gaseous phase and apparatus for growing a thin film in gaseous phase for use in said method

机译:在气相中生长薄膜的方法和用于该方法中的在气相中生长薄膜的设备

摘要

An improved method of growing a thin film in gaseous phase maintaining a uniform thickness and uniform electric properties such as resistivity, etc. over the whole surface of the film, and an apparatus for growing a thin film in gaseous phase adapted to conducting the above method. A method grows the thin film in gaseous phase by flowing down a film-forming reaction gas through plural gas feed ports 1, 2 formed in the top portion of a cylindrical reactor of an apparatus for glowing a thin film in gaseous phase via flow stabilizer plates 3, and bringing the film-forming reaction gas into contact with the wafer substrate A placed on a rotary susceptor 4 disposed on the lower side thereby to grow a thin film on the surface of the substrate, wherein space formed by the inner wall at the top portion of the reactor B and the flow stabilizer plates 3 is sectionalized into plural spatial sections in a concentric manner with the center of the wafer substrate A as nearly a center point, the gas feed ports 1, 2 are arranged to be corresponded to the sections, and at least either the flow rate or the concentration (8, 9) of the film-forming reaction gas fed to any one of the sections is adjusted.
机译:气相生长薄膜的改进方法,其在膜的整个表面上保持均匀的厚度和均匀的电性能,例如电阻率等,以及气相沉积薄膜的设备,适于进行上述方法。一种使薄膜形成反应的气体通过使形成薄膜的装置的圆柱形反应器的顶部中形成的多个气体进料口 1、2 向下流过而使气相的薄膜生长的方法。通过流动稳定器板 3 以气相形式,使成膜反应气体与放置在下侧的旋转基座 4 上的晶片衬底A接触,从而在基板表面上生长薄膜,其中由反应器B顶部的内壁和流量稳定器板 3 形成的空间以同心方式分成多个空间部分以晶片基板A的中心为大致中心点,将气体供给口 1、2 配置为与截面对应,并且流量或浓度( 8、9 )。

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