Cooling device of electronic part having high and low heat generating elements

摘要

The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element generates more heat than the second element. A cooling device includes a heat conductive plate to which heat is transferred from the first element and radiation fins mounted on the heat conductive plate. The radiation fins extend toward the second element, so that at least part of heat transferred from the first element is radiated in the neighborhood of the second element. Even in the case where the electronic part is arranged in a limited space, the cooling efficiency of the electronic part can be improved by alleviating the difference in heat generation density between the neighborhood of the first element and the neighborhood of the second element.