Semiconductor wafer front side pressure testing system and method therefor

摘要

An apparatus and method is disclosed for a semiconductor wafer front side pressure testing system (200, 300, 400). Negative or positive pressure is applied to the top portion of a semiconductor wafer (216, 316) mounted on a support structure or wafer chuck (222, 322, 422). In one embodiment, bellows (232) coupled to the wafer chuck (222, 322, 422) and a platen (218, 318, 418) located above the semiconductor wafer (216, 316) provides a sealed atmosphere above the semiconductor wafer (216, 316) to permit negative or positive pressure to be introduced into this sealed atmosphere. In another embodiment, a seal is provided by a wall portion (421) connected to the chuck (422) contacting a gasket (419) located beneath the platen (418).