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Semiconductor device having reduced line width variations between tightly spaced and isolated features

机译:在紧密间隔和隔离的特征之间具有减小的线宽变化的半导体器件

摘要

A patterned film structure within a semiconductor device includes a pattern formed within a hardmask film, and a pattern formed within an underlying semiconductor or metal film beneath the hardmask film. The etch bias of both isolated and nested features formed within the patterned structure, is substantially the same with respect to a masking film formed over the hardmask film.
机译:半导体器件内的图案化膜结构包括在硬掩模膜内形成的图案和在硬掩模膜下方的下面的半导体或金属膜内形成的图案。相对于在硬掩模膜上形成的掩模膜,在图案化结构内形成的隔离和嵌套特征两者的蚀刻偏压基本相同。

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