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ADC based in-situ destructive analysis selection and methodology therefor
ADC based in-situ destructive analysis selection and methodology therefor
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机译:基于ADC的原位破坏性分析选择及其方法
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摘要
A method of inspecting a semiconductor wafer using scanning tools to find defects that occur during the manufacturing process and to the automatic classification, automatic selection of defects that require further analysis, the automatic selection of the equipment to perform the further analysis and the in-situ performance of the further analysis that includes destructive and non-destructive analysis.
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