A new pattern is provided for the bus lines that are used to facilitate plating of layers of electrical lines that form a Printed Circuit Board. Where Prior Art bus lines have a straight-line geometry, the bus lines of the invention have any geometry that is not a straight-line geometry. The geometry of the bus lines of the invention can be of any design as long as this design allows for interrupted cutting of the bus line, that is the cutting tool does not, during the process of cutting the bus line, make constant and continuous contact with the bus line.
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