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N-type buried layer drive-in recipe to reduce pits over buried antimony layer

机译:N型埋层驱入配方可减少在锑层上的凹坑

摘要

A method of driving-in antimony into a wafer, including the following steps. A wafer is loaded into an annealing furnace/tool. The wafer having an area of implanted antimony ions. The wafer is annealed a first time at a first temperature in the presence of only a first nitrogen gas flow rate. The wafer is ramped-down from the first temperature to a second temperature in the presence of only an oxygen gas flow rate. The wafer is maintained in the presence of the of oxygen gas flow rate at the second temperature. The wafer is ramped-up from the second temperature to a third temperature in the presence of only the oxygen gas flow rate. The wafer is annealed a second time at the third temperature in the presence of only a second nitrogen gas flow rate to drive-in the antimony ions within the area of implanted antimony.
机译:一种将锑压入晶片的方法,包括以下步骤。将晶片装载到退火炉/工具中。晶片具有植入的锑离子区域。在仅存在第一氮气流速的情况下,将晶片在第一温度下第一次退火。在仅氧气流速存在的情况下,晶片从第一温度下降到第二温度。在第二温度下,在氧气流速存在的情况下保持晶片。在仅氧气流速存在的情况下,晶片从第二温度上升到第三温度。在仅存在第二氮气流速的情况下,将晶片在第三温度下第二次退火,以将锑离子驱入注入的锑区域内。

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