Chip scale electrical test fixture with isolation plate having an angled test hole

摘要

A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes at least one hole extending through the isolation plate that exposes the selected subset of the electrical contacts. The hole has a sidewall angled at a non-perpendicular angle from the horizontal plane of the isolation plate. The angle sidewall of the hole provides increased clearance for a fixed compliant probe to land on the solder balls to be tested in an electrical characterization process.