THIXOTROPIC ALUMINIUM-SILICON-COPPER ALLOY SUITABLE FOR SEMI-SOLID SHAPING

摘要

The invention relates to an aluminum alloy for thixoforming with the composition (by weight): Si: 5%-7.2% Cu: 1%-5% Mg1% Zn3% Fe1.5% other elements1% each and3% in total, with % Si7.5-% Cu/3, which, when reheated to the semisolid state to the point at which a liquid fraction ratio between 35 and 55% is obtained, has an absence of non-remelted polyhedral silicon crystals.