Insulation barrier formation on printed circuit board, by interconnecting PCB sections by insulation transformer and forming housing of transformer with one recessed or projecting section extending along housing

摘要

The method involves mechanically interconnecting separate PCB sections (21,22) by an insulation transformer (10). The housing of the insulation transformer is formed with recessed section or projecting section extending along one side of the transformer housing. The method involves forming the separate PCB sections (21,22) by dividing a PCB into the sections after mounting the insulation transformer to the PCB. A material having a comparative tracking index (CTI) higher than the CTI of the PCB, is selected as insulating material for the insulation transformer. The housing of the insulation transformer is formed in a non-planar manner to improve creepage characteristics. The insulation transformer is surface soldered to the PCB sections. Independent claims are also included for the following: (a) printed circuit board assembly; (b) printed circuit board manufacturing method.